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Direct plating on polyimide film

Directly achieve electroless plating with high adhesion, shortened delivery times, and cost reduction!

We have achieved direct electroless plating without the need for a base film such as vapor deposition or sputtering on film substrates, resulting in high adhesion, reduced lead times, and cost savings. Additionally, upon request, it is also possible to form patterns through etching after plating. Hohwa Industries is prepared to assist in research and development for industries with such applications, ready to accommodate even single prototype requests, so please consult us for prototype development. For more details, please contact us or refer to our catalog.